신고사유
신고해주신 내용은 쇼핑몰 운영자의 검토 후 내부 운영 정책에 의해 처리가 진행됩니다.
It is mainly suitable for bonding strip-shaped block samples as a carrier, and TEM observation after ion thinning or double spraying. Such as: the growth of silicon wafers and the adhesion of thin films, observe the cross-section.
Material: copper, nickel, molybdenum, aluminum, tungsten, stainless steel
number | product name | Inner diameter (mm) | Material | Packing/pc |
1 | Oval ring | Hole Φ2×0.5 | Cu Ni Mo Al W SS | 100 pcs/box |
2 | Oval ring | Hole Φ2×1 | Cu Ni Mo Al W SS | 100 pcs/box |
3 | Oval ring | Hole Φ2×1.5 | Cu Ni Mo Al W SS | 100 pcs/box |
4 | Insulation ring | Hole Φ2×1 | Cu Ni Mo Al W SS | 100 pcs/box |
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