신고사유
신고해주신 내용은 쇼핑몰 운영자의 검토 후 내부 운영 정책에 의해 처리가 진행됩니다.
100% solid, silica filled liquid encapsulant designed for quick self-leveling in large dam & fill or glob top applications, & encapsulation of narrow diameter, long, & ultra fine pitch wire bonds on semiconductor devices. Low modulus & CTE, excellent adhesion to inorganic & organic substrates, thermally curable, & non-sweeping. Available in dam & fill or glob top versions.
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