Q300T T Plus – triple target sputter coater for specimens up to 200mm diameter

Safety

The Q300T T Plus meets key industry CE standards

• All electronic components are protected by covers

• Implosion guard prevents user injury in event of chamber failure

• Vacuum interlocks remove power from deposition sources to prevent user exposure to high voltage in event of chamber being opened

• Overheating protection shuts down power supply

Vacuum control

High vacuum turbo pumping allows sputtering of a wide range of oxidising and non-oxidising metals for thin film and electron microscopy applications. Automatic vacuum control which can be pre-programmed to suit the process and material, therefore removing the need for manual intervention or control.

Cool magnetron sputtering

Sputter coating is a technique widely used in various applications; it is possible to create a plasma and sputter metals with high voltage, poor vacuum and no automation.  However, this is not suitable for electron microscopy applications because it can heat the sample and result in damage when the plasma interacts with the sample. The Q series uses low temperature enhanced-plasma magnetrons optimised for the turbomolecular pump pressures, combined with low current and deposition control, which ensures your sample is protected and uniformly coated.

The Q300T T Plus uses easy-change, 57 mm diameter, disc-style targets which are designed to sputter oxidising and noble metals. The Q300T T Plus is fitted as standard with a chromium (Cr) sputter target. Other targets options include; Au, Au/Pd, Pt/Pd, Pd, Pt, Cu, Ir, W, ITO and Al etc.

Pulsed cleaning for aluminium sputtering

Aluminium (Al) rapidly forms an oxide layer which can be difficult to remove. The Q300T T Plus has a special recipe for aluminium that reduces the oxide removal time and prevents excessive pre-sputtering of the target.

Film thickness monitor     

The Q300T T Plus can be fitted with an optional film thickness monitor (FTM), which measures the coating thickness on a quartz crystal monitor within the chamber, in order to control the coating thickness of material deposited on to the sample.